Microwave integrated circuit
AssigneeMitsubishi Denki Kabushiki Kaisha
InventorAkira Inoue
Life of this patent
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Abstract
In a hybrid microwave integrated circuit in which an FET and an LC resonance circuit are integrated, the LC resonance circuit includes an inductor and a capacitor disposed on a substrate having a smooth surface which ensures that the dimensional precision of the inductor will be in a range of.+-.several microns when it is formed on the substrate. Then, the substrate, on which the LC resonance circuit is formed, is mounted on or buried in a high frequency signal transmitting substrate. Therefore, variation in resonant frequency of the LC resonance circuit are reduced, whereby deteriorations in characteristics, such as efficiency, output power and the like, are reduced. In addition, since the LC resonance circuit is reduced in the size and cost of the whole circuit are reduced.
Claims17
A hybrid microwave integrated circuit comprising:
- a high frequency signal transmitting substrate;
- an FET disposed on the high frequency signal transmitting substrate and having an operating frequency;
- a second substrate having a smooth surface;
- and
- an LC resonance circuit comprising electrodes, an inductor, and a capacitor disposed on said second substrate, said smooth surface ensuring that dimensional precision of said inductor as formed is.+-.several microns wherein said second substrate is disposed on said high frequency signal transmitting substrate.
A hybrid microwave integrated circuit comprising:
- a high frequency signal transmitting substrate;
- an FET disposed on said high frequency signal transmitting substrate and having an operating frequency;
- a plurality of second substrates, each second substrate having a smooth surface;
- and
- an plurality of LC resonance circuits, each comprising electrodes, an inductor, and a capacitor, each circuit resonating at a frequency that is an integer multiple of the operating frequency, being disposed on one of said plurality of second substrates, the smooth surfaces ensuring that dimensional precision of each of said inductors as formed is.+-.several microns wherein said second substrates are disposed on said high frequency signal transmitting substrate.
Dependencies are inferred from the claim text.