Method of manufacturing multi-layer thin film circuits containing integrated thin film resistors
AssigneeHightec MG AG
InventorsGerold Brandli, Guido Bachmann
Life of this patent
Estimating the term…
Abstract
In multi-layer thin film circuits, fabricated by alternate formation of conductor layers and insulating layers, there can be integrated thin film resistors which bear directly upon the substrate but nonetheless are not subjected, during manufacture, to the high temperatures of curing of the insulating layers and which then would be damaged. The manufacturing method also allows producing integrated electrical contacting between the thin film resistors and conductors of all of the conductor layers.
Claims8
A method of manufacturing multi-layer thin film circuits containing integrated thin film resistors, comprising the steps of:
- alternately forming conductor and insulating layers upon a substrate;
- forming free zones in all of the formed conductor and insulating layers, with the exception of the last conductor layer located furthest from the substrate;
- thermally treating each formed insulating layer;
- and
- upon completion of the thermal treatment of each formed insulating layer forming within the free zones thin film resistors which directly bear upon the substrate.
A method of manufacturing multi-layer thin film circuits containing integrated thin film resistors, comprising the steps of:
- forming upon a substrate at least two conductor layers and at least one insulating layer located between the at least two conductor layers;
- the conductor layer located furthest from the substrate defining a last conductor layer;
- forming free zones in each of the formed conductor and insulating layers, with the exception of the last conductor layer located furthest from the substrate;
- thermally treating each formed insulating layer;
- and upon completion of the thermal treatment of each formed insulating layer forming within the free zones thin film resistor means which directly bear upon the substrate.
Dependencies are inferred from the claim text.