US 5,225,375 A · Plasma enhanced chemical vapor processing of semiconductor substrates

Abstract

For plasma enhanced chemical vapor processing of semiconductor substrates, substrates are mounted on an elongate support, in a spaced parallel array. A shaft is rotatably mounted on the support and has electrode holding means, the electrodes alternating in polarity. The shaft, when rotated, moves the electrodes down in between the substrates, for positioning of the assembly in a reaction chamber for processing. After processing, and removal from the chamber, the shaft is rotated to move the electrodes out from between the substrates, to permit easy loading and unloading. The substrates are normally supported on boats positioned on the support. A particularly effective rf power feedthrough connects rf power from a power source through the door of the chamber.

Claims16

Dependent claims

Apparatus for plasma enhanced chemical vapour processing of semiconductor substrates, comprising;

an elongate first support means for supporting a plurality of semiconductor substrates in a spaced parallel array, the substrates extending laterally relative to a longitudinal axis of said support means;
second support means mounted on said first support means and comprising a shaft extending parallel to and spaced laterally from said longitudinal axis and spaced electrode holding members positioned along said shaft for holding a plurality of electrodes in a spaced parallel array, said shaft mounted for rotation about an axis extending parallel to and external of the peripheries of said electrodes;
means for rotating said shaft to move electrodes into and out of interleaving relationship with said substrates;
means for supplying rf power to said electrodes.

1 more element

Dependencies are inferred from the claim text.

Plasma enhanced chemical vapor processing of semiconductor substrates

Life of this patent

Plasma enhanced chemical vapor processing of semiconductor substrates

Life of this patent

Abstract

Claims16