X-ray pattern masking by a reflective reduction projection optical system
AssigneeHitachi, Ltd.
InventorsTsuneo Terasawa, Masaaki Itou, Shigeo Moriyama, Soichi Katagiri, Hiroshi Fukuda
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AssigneeHitachi, Ltd.
InventorsTsuneo Terasawa, Masaaki Itou, Shigeo Moriyama, Soichi Katagiri, Hiroshi Fukuda
Estimating the term…
In printing patterns on a mask onto a wafer with high accuracy via a reflective reduction projection optical system by using an X-ray or vacuum ultraviolet beam there is an elliptical mirror having a source position defined in an X-ray source and a position of reflection image of entrance pupil of an imaging optical system with respect to the mask as foci and introducing means for synchronously scanning the mask and wafer. Due to inserting a plane mirror for bending an X-ray by approximately 90.degree. at at least one point in the imaging optical system so that the plane of incidence may be perpendicular to the polarization plane the reflectivity does not lower even when the angle of incidence is 45.degree.. A reflecting mirror or an X-ray filter having a lower reflectivity in the peripheral part thereof as compared with the reflectivity of the central part thereof in the stop position of the imaging optical system, brings about an effect of lessened influence of mutual interference between adjacent pattern provides pattern printing with high shape accuracy.
A fine pattern printing method for performing reduction projection of a pattern drawn on a mask onto a substrate via an imaging optical system by using an source emitting an X-ray or vacuum ultraviolet beam, said fine pattern printing method comprising the steps of:
An apparatus for printing fine patterns on a substrate, comprising:
A fine pattern printing method for performing reduction projection of a pattern drawn on a mask onto a substrate via an imaging optical system by using a source emitting an X-ray or vacuum ultraviolet beam, said fine pattern printing method comprising the steps of:
In an apparatus for printing fine patterns on a substrate including a source for emitting an X-ray or vacuum ultraviolet beam, means for applying said beam onto a mask, imaging optical means for focusing said beam from said mark onto the substrate, and positioning means for moving said substrate to desired positions, the improvement comprising:
A fine pattern printing method for performing reduction projection of a pattern drawn on a mask onto a substrate via an imaging optical system by illuminating said mask with an X-ray or vacuum ultraviolet beam, said fine pattern printing method comprising the step of:
In an X-ray projection exposure apparatus including a source for emitting an X-ray or vacuum ultraviolet beam, imaging optical means for performing reduction projection of a pattern drawn on a mask onto a substrate, and positioning means for positioning said substrate in a predetermined position, the improvement comprising:
Dependencies are inferred from the claim text.