Solid state imaging apparatus in which a solid state imaging device chip and substrate are face-bonded with each other
AssigneeOlympus Optical Co., Ltd.
InventorKiyoshi Tsuji
Life of this patent
Estimating the term…
Abstract
A solid state imaging apparatus which can be made small in the contour is formed of a solid state imaging device chip provided with pad electrodes formed near a photoelectrically converting part, an interal connecting substrate bent so that a plurality of surfaces not on the same plane as this solid state imaging device chip may be formed and face-bonded and connected with the pad electrodes of this solid state imaging device chip through bumping members and electronic parts fitted on this connecting substrate and functionally connected to the solid state imaging device chip.
Claims29
A solid state imaging apparatus comprising:
- a solid state imaging device chip provided on one surface of a connecting substrate, wherein said chip is provided with a photoelectrically converting part formed on one surface of said chip and having a photoelectrically converting function and pad electrodes formed near said photoelectrically converting part, wherein said connecting substrate is bent so that a plurality of surfaces not in the same plane as said solid state imaging device chip may be formed, wherein said plurality of surfaces are face-bonded to and connected with said pad electrodes of said solid state imaging device chip through bumping members;
- and
- electronic parts fitted on said connecting substrate and connected functionally to said solid state imaging device chip.
A solid state imaging apparatus comprising:
- a solid state imaging device chip provided on one surface of a connecting substrate, wherein said chip is provided with a photoelectrically converting part having a photoelectrically converting function on one surface of said chip and pad electrodes electrically connected with said photoelectrically converting part, wherein said connecting substrate is bent so that a imaging device chip may be formed, wherein said plurality of surfaces have inner lead frames face-bonded and connected with said pad electrodes of said solid state imaging device chip through bumping member;
- and
- electronic parts fitted on said connecting substrate and connected functionally to said solid state imaging device chip.
Dependencies are inferred from the claim text.