Bilayer metallization cap for photolithography

A method for patterning a conductive layer comprising the steps of:

• forming a conductive layer to be patterned on a surface of a substrate;
• applying a metal nitride antireflective layer over the surface of said conductive layer;
• forming a barrier layer which includes a silicon-containing component to the surface of said antireflective layer;
• applying a resist layer to said barrier layer, said resist containing a photoinitiator which generates acid groups upon exposure to radiation, said barrier layer inhibiting interaction between said antireflective layer and said acid groups generated during exposure of said resist;
• exposing and developing said resist to uncover portions of said barrier layer in a patterned image;
• removing said uncovered portions of said barrier layer;
• and
• removing corresponding underlying portions of both said antireflective layer and said conductive layer to form a patterned conductive layer.