Hermetically sealed waffle-wall configured assembly including sidewall and cover radiating elements and a base-sealed waveguide window

An assembly for waveguide launching microwave transmissions, comprising:

• a housing base including a first opening formed therethrough having inner side walls;
• a substrate made of an organic material, having top and bottom surfaces, located atop said housing base;
• a housing cover attached to said housing base and hermetically enclosing said substrate;
• a first waveguide section, having a low thermal coefficient of expansion and an outer surface, inserted in said first opening in the housing base, said first waveguide section having one end spaced apart from said bottom surface of the substrate, said first waveguide section having a transformer section located at its other end away from said substrate;
• a choke joint for coupling the first waveguide section to the housing base for absorbing differentials in thermal coefficients of expansion;
• a radiating element aligned over said first waveguide section;
• a two-dimensional array of conductive posts extending substantially perpendicularly to said top surface and said housing cover,
• a microstrip ground plane arranged perpendicular to said conductive posts, wherein said conductive posts provide an RF ground from said microstrip ground plane to said housing cover, a number of said conductive posts surrounding said radiating element;
• and
• wherein said choke joint comprises:
• an eyelet having inner and outer surfaces and including a flange section, said inner surface of said eyelet compression sealed against the outer surface of said first waveguide section, said flange section being hermetically sealed to a lower end of said housing base;
• and
• a first space formed between said outer surface of said eyelet and said inner side walls of the opening in the housing base.

An assembly for waveguide launching microwave transmissions, comprising:

• a housing base including a first opening formed therethrough having inner side walls;
• a substrate made of an organic material, having top and bottom surface, located atop said housing base;
• a housing cover attached to said housing base and hermetically enclosing said substrate;
• a first waveguide section, having a low thermal coefficient of expansion and an outer surface, inserted into said first opening in the housing base, said first waveguide section having one end spaced apart from said bottom surface of the substrate, said first waveguide section having a transformer section located at its other end away from said substrate;
• a choke joint for coupling the first waveguide section to the housing base for absorbing differentials in thermal coefficients of expansion;
• a radiating element aligned over said first waveguide section;
• a two-dimensional array of conductive posts extending substantially perpendicularly to and between said top surface and said housing cover;
• a microstrip ground plane arranged perpendicular to said conductive posts, wherein said conductive posts provide an RF ground from said microstrip ground plane to said housing cover, a number of said conductive posts surrounding said radiating element;
• and
• a second opening formed in said substrate substantially overlapping said first opening in said housing base wherein the radiating element is printed on the one end of the first waveguide section extending through said first opening;
• and
• a ribbon bond coupling said radiating element with the top surface of said substrate.

An assembly for waveguide launching microwave transmissions, comprising:

• a housing base having a thermal coefficient of expansion;
• an opening formed through said housing base having inner side walls;
• a microstrip substrate, having top and bottom surfaces, located atop said housing base;
• a housing cover attached to said housing base enclosing said microstrip substrate, said housing cover being hermetically sealed to the housing base;
• a first waveguide section, having a thermal coefficient of expansion substantially similar to that of said housing base, said first waveguide section having one end extending into said opening in the housing base up to said bottom surface of the microstrip substrate and forming a transformer section at the other end away from said microstrip substrate;
• a waveguide seal compression sealed on its inner surface to the outside of said first waveguide section and on its outer surface being soldered to said inner side walls of the housing base;
• a radiating element located over said first waveguide section;
• and
• a periodic array of conductive posts extending substantially perpendicular to and between said top surface and said housing cover,
• a microstrip ground plane arranged perpendicular to said conductive posts, wherein said conductive posts provide an RF ground from said microstrip ground plane to said housing cover, a number of said conductive posts surrounding said radiating element;
• and
• a second waveguide section larger than said first waveguide section and hermetically sealed at one open end to said waveguide seal and housing base;
• and wherein the transformer section of said first waveguide section extends into the open end of said second waveguide section for impedance matching between the first and second waveguide sections.

An assembly for waveguide launching microwave transmissions, comprising:

• a housing base having a thermal coefficient of expansion;
• an opening formed through said housing base having inner side walls;
• a microstrip substrate, having top and bottom surfaces, located atop said housing base;
• a housing cover attached to said housing base and enclosing said microstrip substrate, said housing cover being hermetically sealed to the housing base;
• a first waveguide section, having a thermal coefficient of expansion substantially similar to that for said housing base, extending at one end into said opening in the housing base up to said bottom surface of the microstrip substrate and forming a transformer section at the other end;
• wherein said first waveguide section is a ceramic waveguide having a metallized outer surface soldered directly to the inner side walls of said opening in the housing base;
• a radiating element located over said first waveguide section;
• and
• a periodic array of conductive posts arranged to extend substantially perpendicular to and between said top surface and said housing cover, a number of said posts surrounding said radiating element.

A structure for radiating waveguide mode transmissions from a ceramic side wall having top and bottom surfaces in an assembly, comprising:

• a housing cover sealed at its edges to the top surface of the ceramic side wall;
• a housing base sealed at its edges to the bottom surface of the ceramic side wall;
• a substrate located atop of said housing base;
• a plurality of conductive posts forming a periodic array, said plurality of posts each being arranged substantially perpendicular to and between said housing cover and substrate;
• a radiating element extending upward from said substrate and unobstructively located near the ceramic side wall in front of one of said conductive posts;
• and
• wherein a number of said conductive posts including said one conductive post reject waveguide mode transmissions not radiated toward the ceramic side wall.

A method for radiating microwave transmissions from a ceramic side wall, having an interior and an exterior, of a hermetically sealed assembly including a housing base, housing cover, microstrip ground plane, and substrate, said substrate being located on top of said housing base between said housing base and housing cover, the method comprising the steps of:

• providing a periodic two-dimensional matrix of conductive posts extending between the housing cover and substrate to provide an RF connection between the microstrip ground plane and said housing cover;
• and
• arranging a substantially vertical radiating element on the substrate, said radiating element being located between the ceramic side wall and one conductive post of said periodic two-dimensional matrix along a line perpendicular to the ceramic side wall running through the one conductive post, said one conductive post reflecting and directing microwave transmissions launched from the radiating element toward the ceramic side wall along said perpendicular line;
• and
• forming an impedance matching bulge along said perpendicular line on the exterior of said ceramic side wall.

A structure for radiating microwave transmissions, comprising:

• a dielectric housing cover having an inner metallization layer;
• an aperture formed in said inner metallization layer;
• a housing base hermetically sealed to the housing cover and forming a ground plane;
• a substrate located atop said housing base;
• a plurality of conductive posts arranged in a two-dimensional matrix array forming a ground current coupling between said inner metallization layer and said ground plane;
• a dielectric puck inserted into an opening in said substrate and housing base between a number of the plurality of conductive posts forming said matrix and underneath said aperture in said inner metallization layer;
• and
• a radiating element formed on said dielectric puck for launching microwave transmissions perpendicular to said substrate and through said aperture and dielectric housing cover.

A structure for radiating microwave transmissions from an assembly, comprising:

• a metal housing cover forming a top shield;
• a housing base hermetically sealed to said housing cover forming a ground plane;
• a substrate located atop said housing base;
• a plurality of conductive posts arranged in a two dimensional matrix forming a ground current coupling between said top shield and said ground plane;
• a dielectric puck inserted into an opening in said substrate and housing base between a number of said plurality of conductive posts forming said matrix of conductive posts;
• an aperture formed in said housing cover over said dielectric puck;
• a radiating element formed on said dielectric puck for launching microwave transmissions perpendicular to said substrate;
• and
• a dielectric window formed in said aperture for allowing transmission of said launched microwave transmissions through said housing cover.