Adhesiveless susceptor films and packaging structures
AssigneeAdvanced Dielectric Technologies, Inc.
InventorsGlenn J. Walters, Gordon E. Walters
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AssigneeAdvanced Dielectric Technologies, Inc.
InventorsGlenn J. Walters, Gordon E. Walters
Estimating the term…
A susceptor composite and related packaging devices employing the susceptor composite comprising a plurality of heat sealable layers is disclosed. The susceptor composite is adhesiveless and is used in food packages for heating and cooking food products in a microwave oven. In one preferred embodiment, a first substrate of amorphous polyester has a metallic microwave absorptive layer deposited on one of its surfaces. A dimensionally stable layer that includes a heat sealable material is heat sealed to at least one of the first substrate and microwave absorptive layer. The heat sealable film can be applied in a pattern and can also be applied using different heat-sealing temperatures to provide selective microwave absorption to the susceptor composite of the invention.
A package material for use in microwave packaging and cooking of food, comprising:
A composite for use in a microwave oven formed into a shape sufficient to enclose a food product to be cooked, the composite comprising:
A package for cooking a food product in a microwave oven, comprising:
An adhesiveless susceptor film comprising a plurality of layers, aid adhesiveless susceptor film comprising a first substrate layer that includes an amorphous polyester, said layer having opposed surfaces, said first substrate layer having a microwave energy-absorptive layer deposited on one of said opposed surfaces;
The susceptor of claim 17, wherein said adjacent layers are heat-sealed to each other at their respective peripheral surfaces.
Dependencies are inferred from the claim text.