Back to results
US 5,217,154 AGranted
Semiconductor bonding tool
AssigneeSmall Precision Tools, Inc.
InventorsRichard Elwood, Kenneth Ellett, Hugo Stebler
Life of this patent
Estimating the term…
Abstract
The disclosure relates to a bonding tool tip bonding electronic interconnects having a shank portion formed of a relatively hard, stiff material having a high modulus of elasticity and a foot portion formed of polycrystalline diamond bonded to the shank portion. The shank portion is preferably formed of tungsten carbide. The foot portion can have an aperture therethrough for feeding of wire to be welded.
Claims12
A bonding tool tip for bonding electronic interconnects to the pads of semiconductor devices, comprising:
- (a) a shank portion formed of a relatively hard, stiff material having a high modulus of elasticity;
- and
- (b) a polycrystalline diamond tapered foot portion bonded to said shank portion.
Dependencies are inferred from the claim text.