High density grid array socket
AssigneeAugat Inc.
InventorsStephen D. DelPrete, Don Santos, Steven R. Corbesero
Life of this patent
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AssigneeAugat Inc.
InventorsStephen D. DelPrete, Don Santos, Steven R. Corbesero
Estimating the term…
A leadless component socket comprises a one- or two-piece leadless component contact socket assembly having a plurality of holes with a respective plurality of spring contacts disposed therein. The socket assembly includes a finger slot or slots to facilitate the manual removal of a chip carrier from the socket and a bias clip and integral keyed corner for assuring proper alignment of the chip carrier with the contacts of the socket assembly. The socket further comprises a cover, a cover support, an insulator assembly and a backup plate or other fastening means for supporting the socket on a printed circuit board. The socket assembly can be configured with a variety of contact terminal ends adapted for a desired mode of circuit board interface. A variety of cover configurations are also accommodated and disclosed.
A high density contact socket comprising:
A high density contact socket comprising:
The high density contact socket of claim 32 wherein said means for applying sufficient pressure comprises at least one downwardly extending beam integral with said single piece cover.
Dependencies are inferred from the claim text.