Lead frame for semiconductor devices having improved adhesive bond line control
AssigneeMicron Technology, Inc.
InventorNancy L. Davis
Life of this patent
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Abstract
Described is a lead frame design which allows for greater control of adhesive thickness which bonds the die with the die paddle on the lead frame. A number of bumps on the surface of the lead frame contact the die, thereby keeping the die a controlled distance from the surface of the die paddle. A sufficient amount of adhesive is applied to the die paddle to ensure a minimum allowable contact of the die with the adhesive, and the adhesive with the lead frame. Enough force is applied to the surface of the die to allow contact between the die and the bumps on the surface of the inventive lead frame. The force applied to the surface of the die, therefore, has no effect on the thickness of the bond line, as long as some minimum amount of pressure is applied.
Claims9
A semiconductor device having a substrate for receiving a semiconductor die, said semiconductor device comprising:
- a) a major surface of said substrate;
- b) bumps on said major surface of said substrate and extending from said major surface of said substrate a distance of 5 mils or less such that said bumps prevent the semiconductor die from resting directly on said major surface;
- and
- c) an adhesive which contacts a major surface of said die and said major surface of said substrate,
- wherein said bumps reduce said contact between said die and said adhesive by 10% or less.
A substrate for receiving a semiconductor die, comprising:
- a) a major surface;
- and
- b) bumps on said major surface of said substrate and extending from said major surface of said substrate a distance of 5 mils or less such that said bumps prevent the semiconductor die from resting directly on said major surface;
- whereby an adhesive which contacts a major surface of said die and said major surface of said substrate reduces said contact between said die and said adhesive by 10% or less.
A lead frame for receiving a semiconductor die, comprising:
- a) a die paddle;
- and
- b) bumps on said die paddle and extending from said die paddle a distance of 5 mils or less such that said bumps prevent the semiconductor die from resting directly on said die paddle,
- whereby an adhesive which contacts a major surface of said die and said major surface of said substrate reduces said contact between said die and said adhesive by 10% or less.
Dependencies are inferred from the claim text.