Cleaning agents for fabricating integrated circuits and a process for using the same
AssigneeAir Products and Chemicals, Inc.
InventorsDavid A. Bohling, John C. Ivankovits, David A. Roberts
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Abstract
This invention is a vapor-phase process for cleaning metal-containing contaminants from the surfaces of integrated circuits and semiconductors between the numerous fabricating steps required to manufacture the finished electronic devices. The process comprises contacting the surface to be cleaned with an effective amount of a cleaning agent comprising a carboxylic acid selected from acetic acid or formic acid at a temperature sufficient to form volatile metal-ligand complexes on the surface of the substrate to be cleaned. The volatile metal-ligand complexes are sublimed from the surface of the substrate providing a clean, substantially residue-free surface.
Claims7
A process for cleaning metal-containing contaminants from a surface of a substrate of the type used in fabricating integrated circuits and semiconductors comprising contacting the surface with an effective amount of a cleaning agent comprising a carboxylic acid selected from the group consisting of formic acid and acetic acid in the vapor phase at a temperature sufficient to form a volatile metal-ligand complex and subliming the metal-ligand complex to remove the metal contaminants and provide a clean surface.
Dependencies are inferred from the claim text.