Semiconductor module having projecting cooling fin groups
AssigneeAkzo N.V.
InventorsEleanor van Andel, Carolina A. M. C. Dirix
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Abstract
A semiconductor module with provisions for improved cooling and interconnection so as to allow for maximum chip packaging density. Air cooling is brought about by a zig-zag arrangement of groups of thin wire cooling fins mounted on a heat dissipating conductor unit also providing the necessary mechanical rigidity of the module. The interconnection comprises a layer containing grains, preferably diamond, leaving high electrically insulating and high thermally conductive properties.
Claims13
A semiconductor module comprised of (1) at least one semiconductor chip, (2) at least one heat dissipating conductor unit, said heat dissipating conductor unit connected to the back side of said semiconductor chip, and (3) a plurality of closely spaced wire cooling fins of a high thermally conductive material, said cooling fins being attached to the side of the heat dissipating conductor unit facing away from said semiconductor chip and said cooling fins projecting away from said semiconductor chip, wherein said cooling fins are positioned in cooling fin groups separated from each other by interspaces having a longitudinal direction substantially parallel to said heat dissipating conductor unit, said cooling fin groups comprising closely spaced wires and being adapted to provide fluid communication between the adjacent interspaces, said interspaces alternately being inlets and outlets for the flow of coolant through said cooling fin groups.
Dependencies are inferred from the claim text.