Insulating material with coefficient linear expansion matching that of one substrate over connection between two conductive patterns
AssigneeMitsubishi Denki Kabushiki Kaisha
InventorKazuo Yoshioka
Life of this patent
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Abstract
An electric circuit wherein an insulating material having a coefficient of linear expansion approximately equal to that of glass is bonded to a part where an electrode pattern formed on a glass substrate is connected to a conductive pattern formed on a substrate made of an insulating material such as polyimide or the like, thereby restricting the thermal stress to be small at the connecting part between the conductive pattern and electrode pattern.
Claims9
An electric circuit composed of plural circuit patterns which are formed on respective substrate and connected with each other, comprising:
- a first circuit pattern formed on a substrate having a first coefficient of linear expansion;
- a second circuit pattern formed on a substrate having a second coefficient of linear expansion and connected with said first circuit pattern;
- and
- an insulating material having approximately the equal coefficient of linear expansion as the first coefficient of linear expansion and bonded at least to a part were said second circuit pattern is connected to said first circuit pattern.
An electric circuit composed of plural circuit pattern which are formed on independent substrates and connected with each other, comprising:
- an electrode pattern formed on a glass substrate;
- a conductive pattern formed on a substrate of a first insulating material having a coefficient of linear expansion larger than that of glass and connected to said electrode pattern;
- and
- a second insulating material bonded at least to a part where said conductive pattern is connected to said electrode pattern, and having the coefficient of linear expansion approximately equal to that of glass.
Dependencies are inferred from the claim text.