Composite lead frame
AssigneeSumitomo Metal Mining Co., Ltd.
InventorKinya Oigawa
Life of this patent
Estimating the term…
Abstract
A composite lead frame in which an island formed with a greater diameter than that of a semiconductor device to be mounted is attached to a lead frame main body having leads being integrally protruded inward, the top ends of the leads are bonded with corresponding fine leads of the island at one ends thereof and lead terminals of the semiconductor device are connected respectively to the other ends of the corresponding fine leads, wherein the composite lead frame comprises an insulating sheet appended on one surface of the island and having the fine leads secured thereto being protruded outward and through holes disposed discretely passing through the insulating sheet and the island so that the wire bonding portions at the other ends of the fine leads are exposed.
Claims4
A composite lead frame which comprises:
- a lead frame main body which defines an outer portion and an inner island portion which has opposite surfaces, said outer portion including leads that extend inwardly towards said island portion, said island portion having a plurality of through holes therethrough and being adapted to mount a semiconductor device on one of said opposite surfaces thereof,
- a flexible polyimide insulating sheet bonded to one of said opposite surfaces of said island portion of said lead frame main body, said insulating sheet including through holes in register with said through holes in said lead frame main body, and
- a plurality of fine leads attached to said insulating sheet on a surface thereof opposite said island portion and which extend from inner ends to outer ends, said inner ends being in register with said through holes and to which the leads of a semiconductor device can be respectively attached, said outer ends being in contact with respective said leads that extend inwardly towards said island portion from the outer portion of said lead frame main body.
The combination of a composite lead frame and a semiconductor device, said composite lead frame comprising:
- a lead frame main body which defines an outer portion and an inner island portion which has opposite surfaces, said outer portion including leads that extend inwardly towards said island portion, said island portion having a plurality of through holes therethrough and being adapted to mount a semiconductor device on one of said opposite surfaces thereof,
- a flexible polyimide insulating sheet bonded to one of said opposite surfaces of said island portion of said lead frame main body, said insulating sheet including through holes in register with said through holes in said lead frame main body,
- a plurality of fine leads attached to said insulating sheet on a surface thereof opposite said island portion and which extend from inner ends to outer ends, said inner ends being in register with said through holes and to which the leads of a semiconductor device can be respectively attached, said outer ends being in contact with respective said leads that extend inwardly towards said island portion from the outer portion of said lead frame main body,
- and said semiconductor device being mounted on a surface of said island portion of said lead frame main body opposite said insulating sheet and including device leads which extend through said through holes and are connected to respective inner ends of said fine leads.
The combination of a composite lead frame and a semiconductor device, said composite lead frame comprising:
- a lead frame main body which defines an outer portion and an inner island portion which has opposite surfaces, said outer portion including leads that extend inwardly towards said island portion, said island portion having a plurality of through holes therethrough and being adapted to mount a semiconductor device on one of said opposite surfaces thereof,
- a flexible polyimide insulating sheet bonded to one of said opposite surfaces of said island portion of said lead frame main body, said insulating sheet including through holes in register with said through holes in said lead frame main body and a device hole,
- a plurality of fine leads attached to said insulating sheet on a surface thereof opposite said island portion and which extend from inner ends to outer ends, said inner ends being in register with said through holes and to which the leads of a semiconductor device can be respectively attached, said outer ends being in contact with respective said leads that extend inwardly towards said island portion from the outer portion of said lead frame main body,
- and said semiconductor device being mounted on said island portion and extending through said device hole in said insulating sheet and including device leads connected to respective inner ends of said fine leads.
Dependencies are inferred from the claim text.