Back to results
US 5,212,279 AGranted
Hot-melt adhesive and its use in polyimide film and printed circuit board
AssigneeHitachi Chemical Company, Ltd.
InventorsYoshihiro Nomura, Takashi Morinaga, Toshiaki Fukushima, Hiroshi Minamisawa, Kazuhito Hanabusa
Life of this patent
Estimating the term…
Abstract
A hot-melt adhesive comprising a special polyamideimide or polyamide is excellent in heat resistance and adhesive strength and usable for providing substrates for printed circuit boards.
Claims41
A hot-melt adhesive comprising at least one member selected from the group consisting of a polymer having repeating units of the formula:
- ##STR27## wherein R.sub.1, R.sub.2, R.sub.3 and R.sub.4 are independently a hydrogen atom, a lower alkyl group, a lower alkoxy group or a halogen atom;
- X is the same or different group in every repeating unit and is a direct link, --O--, --S--, ##STR28## R.sub.5 and R.sub.6 are independently a hydrogen atom, a lower alkyl, group, a trifluoromethyl group, a trichloromethyl group or a phenyl group;
- Y is the same or different group in every repeating unit and represent by the formula:
- ##STR29## Ar is a divalent aromatic group;
- and Ar' is a trivalent aromatic group, and a polymer having repeating units of the formula:
- ##STR30## wherein m is zero or an integer of 1 to 4;
- R.sub.1 ' is a lower alkyl group;
- R.sub.2 ' is a lower alkyl group or a halogen atom;
- X' is the same or different group in every repeating unit and is a direct link, --O-- or ##STR31## R.sub.5 ' and R.sub.6 ' are independently a hydrogen atom, a lower alkyl group, a trifluoromethyl group or a phenyl group;
- and Y is as defined above.
7 more elements
Dependencies are inferred from the claim text.