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US 5,212,234 AGranted
Moulding compound based on thermosetting resin material
AssigneeDSM Resins B.V.
InventorsRene L. E. Van Gasse, Andreas N. J. Verwer
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Abstract
The invention relates to a moulding compound based on thermosetting resin material and optionally fibers, fillers, curing catalysts and further usual additives, and is characterized in that the moulding compound comprises a mixture of at least two thermosetting resins of which a first resin is in a partly cured state, and of which a second resin is not, or less than the first resin in a partly cured state.
Claims9
The molding compound comprising:
- a mixture of at least two thermosetting resins, the first resin being partially cured to a viscosity greater than 50,000 Pas at 20.degree. C. by radical polymerization, the second resin having a viscosity less than 100 Pas at 150.degree. C., said thermosetting resins consisting essentially of
- (a) alkenically unsaturated crosslinkable polyesters, in combination with
- (b) alkenically unsaturated monomers, alkenically unsaturated prepolymers, or mixtures of alkenically unsaturated monomers and prepolymers, said first resin containing fibers and the particles of said first resin being dispersed in said second resin.
Dependencies are inferred from the claim text.