Free flowing moulding materials based on polyamides containing bisphenols

A polyamide moulding material which can be processed by thermoplastic means and contains diene or acrylic rubber or both, and contains 10% to 20% by weight, relative to the polyamide content, of at least one bisphenol selected from the group consisting of dihydroxydiphenyls, bis-(hydroxyphenyl)alkanes, bis-(hydroxyphenyl)-cycloalkanes, bis-(hydroxyphenyl) sulphides, bis-(hydroxyphenyl) ethers, bis-(hydroxyphenyl) ketones, bis(hydroxyphenyl) sulphoxides, bis-(hydroxyphenyl) sulphones and, bis-(hydroxyphenyl)-diisopropylbenzenes, and wherein the amount of diene and acrylic rubber is 10 to 40%, by weight, relative to the polyamide content.