Low corrosivity catalyst for activation of copper for electroless nickel plating
AssigneeApplied Electroless Concepts Inc.
InventorsGerald A. Krulik, Nenad V. Mandich
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Abstract
This invention relates to electroless nickel plating of metals which are normally noncatalytic for electroless nickel initiation. It is especially useful in the electronics industry, including production of electroless nickel/electroless gold tabs or surface mount pads on printed circuit boards, and for use in electroless nickel plating over copper for radiofrequency interference shielding. More particularly, it comprises alkali halide salt solutions of a palladium salt with another Group VIII precious metal salt in an inorganic acid solution for effectively and completely catalyzing the initiation of electroless nickel plating on copper substrates.
Claims15
A catalyst composition for initiation of an electroless metal plating composition on otherwise nonplatable metallic materials, comprising an aqueous solution containing a mixture of a palladium salt and at least one other Group VIII precious metal salt, an alkali halide salt and an inorganic acid.
Dependencies are inferred from the claim text.