Method for microelectronic device packaging employing capacitively coupled connections

A method for encapsulation of a plurality of microelectronic devices comprising the steps of:

• providing a plurality of microelectronic devices on a first common substrate, including interconnection contacts disposed on the microelectronic devices;
• depositing a passivation layer over the first common substrate including the plurality of microelectronic devices and the interconnection contacts;
• providing alternating current coupled electrodes positioned on the passivation layer and over the interconnection contacts;
• providing a plurality of base substrates including a plurality of pressure contact electrodes and vias, joined into a second common substrate;
• bonding the second common substrate to the first common substrate with a bonding agent for providing for a mechanical bond between the plurality of microelectronic devices and the plurality of base substrates, and for providing for electrical coupling between the pressure contact electrodes and the alternating current coupled electrodes positioned on the passivation layer;
• and
• separating the first and second common substrates into a plurality of individual packaged microelectronic devices.