Electroplating means for perforated printed circuit boards to be treated in a horizontal pass

An electroplating apparatus for electroplating perforated printed circuit boards undergoing horizontal movement in a throughput path, comprising:

• (a) at least one upper anode above said throughput path;
• (b) at least one lower anode under said throughput path;
• (c) a plurality of upper electrolyte feeder elements and a plurality of upper electrolyte discharge elements aligned transversely and in alternation above said throughput path forming in combination an upper means for creating a first sequentially alternating flow of electrolyte in said throughput path;
• (d) a plurality of lower electrolyte feeder elements and a plurality of lower electrolyte discharge elements aligned transversely and in alternation under said throughput path forming in combination a lower means for creating a second sequentially alternating flow of electrolyte in said throughput path;
• and
• (e) said upper means and said lower means being positioned relative to each other so that said first sequentially alternating flow flows oppositely with respect to said second sequentially alternating flow.