Method and apparatus for sputtering of a liquid
AssigneeSiemens Solar Industries, L.P.
InventorKarl E. Knapp
Life of this patent
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Abstract
A method and apparatus for practicing the method of sputtering target material onto a substrate by utilizing a cathode member of a sputtering apparatus, the cathode member having an exterior surface. The method comprises applying a liquid target material to a generally downwardly exposed surface portion of the exterior surface of the cathode member such that at least a portion of the liquid target material exhibits a generally downwardly exposed surface and positioning next to the surface of the cathode member the substrate for receiving target material sputtered from the liquid target material exhibiting a generally downwardly exposed surface.
Claims113
A method of sputtering target material onto an object by utilizing a cathode member of a sputtering apparatus, the cathode member having an exterior surface, comprising the steps of:
- (a) applying a liquid target material by intermediate transfer means to the exterior surface of the cathode member such that at least a portion of said liquid target material exhibits a surface generally exposed in a direction other than vertically upwards;
- and
- (b) positioning next to the surface of the cathode member the object for receiving target material sputtered from said liquid target material exhibiting a surface generally exposed in a direction other than vertically upwards.
Sputtering apparatus for sputtering a target material upon an object, comprising:
- (a) an evacuable coating chamber having a sputtering zone;
- (b) a cathode assembly having a rotating cathode and an outer surface;
- (c) a pool for liquid target material to be sputtered;
- (d) means for applying a layer of the liquid target material from a pool of liquid target material on the outer surface of the cathode assembly such that at least a portion of the layer exhibits a surface generally exposed in a direction other than vertically upwards;
- and
- (e) means for transporting objects into the vicinity of the cathode assembly for receiving target material sputtered from the layer of the liquid target material exhibiting the surface generally exposed in a direction other than vertically upwards.
Magnetron cathode sputtering apparatus, comprising:
- (a) an evacuable coating chamber;
- (b) a cathode assembly having an outer surface;
- (c) magnetic means positioned at least partially in a carrier means having an outer surface for providing a defined sputtering zone;
- (d) a pool within the chamber for liquid target material to be sputtered, the pool extending parallel to and adjacent the outer surface of the carrier means;
- (e) means for applying a layer of liquid target material from the pool of liquid target material onto the outer surface of the cathode assembly;
- and
- (f) means for supporting and positioning substrates to be coated in the chamber and in proximity to the sputtering zone.
A method of sputtering target material onto a substrate by utilizing a cathode member of a sputtering apparatus, the cathode member having an exterior surface whereof at least a portion is downwardly exposed, comprising the steps of:
- (a) applying and maintaining a uniform layer of liquid target material to the exterior surface of the cathode member such that at least a portion of said liquid target material exhibits a generally downwardly exposed surface;
- and
- (b) positioning next to the surface of the cathode member the substrate for receiving target material sputtered from said liquid target material exhibiting a generally downwardly exposed surface.
A method of sputtering target material onto substrates by utilizing a rotating cathode member of a magnetron sputtering apparatus, the cathode member having a rotating exterior surface, comprising the steps of:
- (a) applying a liquid target material to the rotating exterior surface of the rotating cathode member by intermediate transfer means;
- and
- (b) positioning next to the rotating exterior surface of the rotating cathode member the substrates to receive the target material sputtered from said liquid target material.
Sputtering apparatus for sputtering a target material upon a substrate, comprising:
- (a) an evacuable coating chamber having a sputtering zone;
- (b) a cathode assembly having an outer surface;
- (c) a pool within the chamber for liquid target material to be sputtered;
- (d) means for applying and maintaining a uniform layer of the liquid target material from the pool of liquid target material on the outer surface of the cathode assembly such that at least a portion of the layer exhibits a generally downwardly exposed surface;
- and
- (e) means for transporting substrates into the vicinity of the cathode assembly for receiving target material sputtered from the layer of the liquid target material exhibiting the generally downwardly exposed surface.
Magnetron cathode sputtering apparatus, comprising:
- (a) an evacuable coating chamber;
- (b) a cathode assembly having an outer surface;
- (c) magnetic means positioned at least partially in a carrier means for providing a defined sputtering zone;
- (d) a pool within the chamber for liquid target material to be sputtered, the pool extending parallel to and adjacent the outer surface of the carrier means;
- (e) means for applying and maintaining a uniform layer of liquid target material from the pool of liquid target material on the outer surface of the cathode assembly;
- and
- (f) means for supporting and positioning substrates to be coated in the chamber and in proximity to the sputtering zone.
Rotatable magnetron sputtering apparatus for sputtering a target material upon substrates, which comprises:
- (a) an evacuable coating chamber;
- (b) a cathode assembly having an elongated rotatable cylindrical tube mounted in the chamber, the tube having an outer surface;
- (c) magnetic means positioned at least partially in the cylindrical tube for providing a sputter zone of defined width extending lengthwise of the cylindrical tube;
- (d) means for rotating the elongated rotatable cylindrical tube;
- (e) a pool for liquid target material to be sputtered;
- (f) means for applying a substantially uniform thickness of the liquid target material from the pool of liquid target material on and extending lengthwise of the outer surface of the elongated rotatable cylindrical tube for sputtering as the tube is rotated in the sputtering zone;
- and
- (g) means for transporting substrates into the vicinity of the sputtering zone of the elongated rotatable cylindrical tube to receive the target material sputtered from the outer surface of the cylindrical tube.
Magnetron cathode sputtering apparatus, comprising:
- (a) an evacuable coating chamber;
- (b) a cathode assembly having an elongated rotatable carrier means mounted in the chamber, the carrier means having an outer surface;
- (c) magnetic means positioned at least partially in the carrier means for providing a sputter zone of defined width extending lengthwise of the carrier means;
- (d) a pool within the chamber for liquid target material to be sputtered, the pool extending parallel to and adjacent the outer surface of the carrier means;
- (e) means for applying and maintaining a uniform layer of liquid target material from the pool of liquid target material on the outer surface of the carrier means for sputtering;
- (f) means for rotating the carrier means about its longitudinal axis;
- and
- (g) means for supporting and positioning substrates to be coated in the chamber and in proximity to the sputtering zone.
Dependencies are inferred from the claim text.