Solder paste and method of using the same
AssigneeAT&T Bell Laboratories
InventorYinon Degani
Life of this patent
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Abstract
A solder paste that is useful in applications such as surface mounting of components on printed circuit boards has been found. After soldering, the residue requires no cleaning. The achievement of these desirable properties is accomplished by employing a solder flux vehicle including a three component residue modifier.
Claims16
A process for soldering a multiplicity of components to a substrate, said process comprising the steps of 1) subjecting said components and said substrate to a paste wherein said paste comprises solder particles and a vehicle, and 2) heating said paste to the reflow temperature in an inert environment characterized in that said vehicle comprises an acid, a viscosity modifier, a solvent composition, and a mixture wherein said mixture comprises A) a rosin or a dimerized rosin, B) castor oil, and C) pentaerythritol tetrabenzoate or bis(2-ethyl hexyl) sebacate.
A solder paste comprising solder particles and a vehicle wherein said vehicle comprises an acid, a viscosity modifier, and a solvent composition characterized in that said vehicle also includes a mixture comprising A) a rosin or dimerized rosin, B) castor oil, and C) pentaerythritol tetrabenzoate or bis(2-ethyl hexyl) sebacate.
Dependencies are inferred from the claim text.