Soldering flux composition
AssigneesNippondenso Co., Ltd., Harima Chemicals, Inc.
InventorsMasanori Takemoto, Tatsushi Onishi, Masami Aihara
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Abstract
A soldering flux composition comprising, as a flux base resin, a modified amine compound obtained by reacting (i) at least one member selected from the group consisting of vinyl group-containing compounds, carboxyl group-containing compounds and epoxy group-containing compounds (ii) with an amine compound having an active hydrogen.
Claims6
A soldering flux composition comprising:
- as a flux base resin, a modified amine compound obtained by reacting (i) at least one compound selected from the group consisting of vinyl group-containing compounds, carboxyl group-containing compounds and epoxy group-containing compounds (ii) with an amine compound having at least one hydrogen atom.
A soldering flux composition comprising, as a flux base resin, 1% to 80% by weight, based upon the total weight of the flux composition a modified amine compound obtained by reacting (i) at least one compound selected from the group consisting of vinyl group-containing compounds, carboxyl group-containing compounds and epoxy group-containing compounds (ii) with an amine compound having an active hydrogen at an equivalent ratio (i)/(ii) of 0.03 to 1.0.
A soldering flux composition comprising:
- (A) a modified amine compound obtained by reacting (i) at least one member selected from the group consisting of vinyl group-containing compounds, carboxyl group-containing compounds and epoxy group-containing compounds (ii) with an amine compound having an active hydrogen, as a flux base resin;
- and
- (B) an activator.
Dependencies are inferred from the claim text.