Printed wiring board with electromagnetic wave shielding layer
AssigneeNippon CMK Corp.
InventorsHirotaka Okonogi, Katsutomo Nikaido, Junichi Ichikawa
Life of this patent
Estimating the term…
Abstract
A printed wiring board has an electromagnetic wave shielding layer. The printed wiring board includes a printed circuit formed on a substrate. Stratified layers of insulation are formed over the printed circuit. The insulation layers are disposed so as to form a bowl-shaped connection region. A terminal may be formed simultaneously with the forming of the electromagnetic wave shielding layer to provide a connection between the electromagnetic shielding layer and the printed circuit. The bowl-shaped connecting region provides for smoothly filling the terminal with a conductor paste without the occurrence of foaming or blurring during, for example, a silk screening printing process.
Claims11
A printed wiring board comprising:
- an electromagnetic wave shielding layer formed on a printed circuit on at least one surface of a substrate over a plurality of successively formed insulative layers having increasingly larger apertures defining a bowl-shaped opening, the bowl-shaped opening having a bottom defined by the printed circuit and sides inwardly sloping towards the bottom;
- and
- a grounding circuit electrically connected to said electromagnetic wave shielding layer and printed circuit by a bowl-shaped connecting region formed in the bowl-shaped opening by filling a conductive paste comprising the electromagnetic wave shielding layer into the bowl-shaped opening;
- whereby the inwardly sloping sides are effective to facilitate entry of the conductive past into the bowl-shaped opening during the formation of the bowl-shaped connecting region.
A printed wiring board comprising:
- a substrate;
- a printed circuit layer formed on at least one surface of the substrate;
- a series of insulative layers formed successively one over the other on the printed circuit layer with increasingly larger apertures defining at least one bowl-shaped connecting region, each bowl-shaped connecting region having a bottom defined by the printed circuit layer and sides inwardly sloping towards the bottom whereby the inwardly sloping sides are effective to facilitate entry of conductive paste into the bowl-shaped connecting region during formation of bowl-shaped terminal portions;
- and
- an electromagnetic wave shielding layer formed on the insulative layers and having bowl-shaped terminal portions formed by filling a conductive paste which comprises the electromagnetic wave shielding layer into each bowl-shaped connecting region so as to form the bowl-shaped terminal portions.
A method of manufacturing a printed wiring board comprising the steps of:
- providing a substrate;
- forming a printed circuit layer on at least one surface of the substrate;
- successively forming a series of insulative layers on the printed circuit layer with the successive layers having increasingly larger apertures which jointly define at least one bowl-shaped connecting region, each bowl-shaped connecting region having a bottom defined by the printed circuit layer and sides inwardly sloping towards the bottom whereby the inwardly sloping sides are effective to facilitate entry of conductive paste into the bowl-shaped connecting region during subsequent formation of a bowl-shaped terminal portion;
- and forming an electromagnetic wave shielding layer on the electromagnetic wave shielding layer having a bowl-shaped terminal portion formed in the bowl-shaped connecting region by filling a conductive paste which comprises the electromagnetic wave shielding layer into the bowl-shaped connecting region so as to form the bowl-shaped terminal portion.
Dependencies are inferred from the claim text.