Back to results
US 5,210,375 AGranted
Electronic device package--carrier assembly ready to be mounted onto a substrate
AssigneeVLSI Technology, Inc.
InventorJon M. Long
Life of this patent
Estimating the term…
Loading patent…
Loading patent…
AssigneeVLSI Technology, Inc.
InventorJon M. Long
Estimating the term…
The exposed portions of the leads of a semiconductor chip package are first bent in a forming process so that the ends of the leads are in proper positions to be attached to and electrically connected to contacts on a printed circuit board. Intermediate portions of the leads between the distal ends and the package body for connection to the printed circuit board and the package body are enclosed and fixed in position by a carrier body to hold the leads in position and to reduce the effects of any bending in destroying the coplanarity of the distal lead ends of the package. The package with the carrier body may be mounted onto the printed circuit board without first removing the carrier body. After the distal ends of the leads have been soldered to the printed circuit board, the carrier body is then removed.
A packaged electronic device assembly to be mounted onto a substrate and electrically connected to contacts on the substrate, said assembly comprising:
The assembly of claim wherein the package and carrier bodies enclose most of each of the leads, leaving only the distal ends of the leads exposed for connection to the contacts.
Dependencies are inferred from the claim text.