Silicone rubber composition and method for the production of silicone rubber moldings
AssigneeDow Corning Toray Silicone Co., Ltd.
InventorsYoshito Ushio, Akito Nakamura
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Abstract
A silicone rubber composition is prepared by mixing a diorganopolysiloxane which contains 0.1 to 5 weight % of low-molecular-weight organosiloxane with a vapor pressure at 200.degree. C. of at least 10 mm Hg, with at least 90 weight % of a low-molecular-weight organosiloxane with a boiling point not exceeding 250.degree. C. at 760 mm Hg and a curing agent with filler being optional. These silicone rubber compositions are useful for silicone rubber moldings which can be used to in applications involving electrical switch contacts resulting in electrical switch contact conduction free of defects.
Claims5
A silicone rubber composition comprising
- (A) 100 weight parts diorganopolysiloxane which contains 0.1 to 5 weight % low-molecular-weight organosiloxane whose vapor pressure at 200.degree. C. is at least 10 mm Hg, wherein at least 90 weight % of this low-molecular-weight organosiloxane comprises low-molecular-weight organosiloxane with a boiling point not exceeding 250.degree. C. at 760 mm Hg
- (B) 0 to 300 weight parts filler, and
- (C) curing agent in a quantity sufficient to cure the composition wherein the curing agent is an organoperoxide or a combination of organohydrogenpolysiloxane with a platinum catalyst.
A method for the production of silicone rubber moldings wherein said method comprises filling a silicone rubber composition comprising
- (A) 100 weight parts diorganopolysiloxane which contains 0.1 to 5 weight % low-molecular-weight organosiloxane whose vapor pressure at 200 degrees Centigrade is at least 10 mm Hg, wherein at least 90% of this low-molecular-weight organosiloxane has bp.sub.760 .ltoreq.250.degree. C.,
- (B) 0 to 300 weight parts filler, and
- (C) curing agent in a quantity sufficient to cure the composition
- into a mold and thermally curing same in order to form a silicone rubber molding, and
- removing the aforesaid low-molecular-weight organosiloxane with bp.sub.760 .ltoreq.250.degree. C. by heating this molding at 150.degree. C. to 250.degree. C.
Dependencies are inferred from the claim text.