Allyl magnesium halide modified epoxy resin composition
AssigneeCheil Industries Inc.
InventorsWhan G. Kim, Tai Y. Nam
Life of this patent
Estimating the term…
Abstract
A modified epoxy resin of the general formula (I) is prepared by dissolving an epoxy resin in a solvent, adding the mixture to allyl magnesium halide at -70.degree. C. under a nitrogen atmosphere, and removing the solvent and salts from the resultant product. The modified epoxy resin is useful for epoxy maleimide resin compositions as a heat resistance enhancer. An epoxy resin composition for sealing semiconductor elements comprising the modified epoxy resin as a heat resistance enhancer is an amount of from 0.1 to 30% by weight, based on the total weight of the composition, is also provided. ##STR1## wherein, R represents H or C.sub.1 to C.sub.10 -alkyl group and m represents an integer of 0 to 100 and n represents an integer of 1 to 100.
Claims15
Epoxy resin compositions for sealing semiconductor elements comprising an allyl-modified epoxy resin of formula (I) as a heat resistance enhancer ##STR4## wherein R represents H or C1-C10 alkyl and m represents an integer of 0 to 100 and n represents an integer of 1 to 100;
- and an epoxy resin other than said allyl-modified epoxy resin of formula (I).
Dependencies are inferred from the claim text.