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US 5,210,006 AGranted
Process for preparing mounting tapes for automatic mounting of electronic components
AssigneeE. I. Du Pont de Nemours and Company
InventorManfred Sondergeld
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Abstract
The process of the invention produces tapes for automatic mounting of electronic components. These mounting tapes have metallic conductive tabs with metallic bumps on at least one of their ends. The metallic bumps can be thermally welded or soldered, have well-defined areas and heights, and adhere well to the conductive tabs.
Claims10
Process for preparing a mounting tape with metallic conductive tabs having metallic bumps on at least one of their ends, comprising the following process steps:
- a) coating a metal surface of a mounting tape with a light-sensitive composition, thereby forming process electroplating resist;
- b) exposing the light-sensitive composition through a transparency with a pattern corresponding to the metallic bumps to be formed,
- c) removing the exposed area corresponding to the metallic bumps to be formed,
- d) forming the metallic bumps by electrodeposition of a metal,
- e) removing the electroplating resist,
- f) re-applying a light-sensitive composition layer on the metal surface of the mounting tape, covering the already-formed metallic bumps, thereby forming an etching resist,
- g) exposing the light-sensitive layer through a transparency with a pattern corresponding to the metallic conductive tabs to formed,
- h) removing the exposed layer areas corresponding to the metal areas to be removed,
- i) removing the exposed metal, and
- j) removing the etching resist.
7 more elements
Dependencies are inferred from the claim text.