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US 5,209,390 AGranted
Hermetic package and packaged semiconductor chip having closely spaced leads extending through the package lid
AssigneeGeneral Electric Company
InventorsVictor A. K. Temple, Donald L. Watrous, Constantine A. Neugebauer, James F. Burgess, Homer H. Glascock, II
Life of this patent
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Abstract
A hermetic semiconductor package having a ceramic lid with the device leads extending vertically through the lid is disclosed. The leads are mechanically retained within the apertures in the lid and direct bonded to the lid to provide a hermetic seal and a substantial lead density.
Claims5
A method of fabricating a packaged semiconductor chip comprising the steps of:
- providing a ceramic lid having first and second opposed major surfaces and a plurality of apertures therein;
- placing a conductive pellet in each of said apertures;
- compressing said conductive pellets in a direction substantially perpendicular to said first major surface to expand said pellets in a direction parallel to said first major surface and into intimate contact with the wall of said aperture;
- and
- bonding contact pads on said chip to said pellets and bonding said lid to a package base to seal said package.
2 more elements
Dependencies are inferred from the claim text.