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US 5,209,120 AGranted
Semiconductor pressure-detecting apparatus
AssigneeMitsubishi Denki Kabushiki Kaisha
InventorToru Araki
Life of this patent
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Abstract
A semiconductor pressure-detecting apparatus includes a semiconductor chip having a diaphragm and a frame molded within a resin with the diaphragm exposed. A reference pressure chamber may be provided between the diaphragm and the frame. Since the diaphragm is exposed, a medium, the pressure of which is to be measured, easily contacts the diaphragm. Therefore, if the stem is connected to a case containing the medium, a high pressure can be measured.
Claims5
A semiconductor pressure-detecting apparatus comprising:
- a semiconductor chip including a diaphragm for responding to a stress applied by a medium under pressure and a strain gauge for converting the stress into an electrical signal;
- a frame supporting said semiconductor chip;
- a stem supporting said frame;
- a wire connected to said semiconductor chip;
- a lead connected to said wire and penetrating said stem;
- and
- a resin disposed on a first side of said stem encapsulating said wire, said lead on the first side of said stem, said frame, and part of said semiconductor chip, said resin including an opening through which said diaphragm is exposed for directly contacting the medium, the pressure of which is to be detected from the stress applied to said diaphragm.
4 more elements
Dependencies are inferred from the claim text.