Memory card with flexible conductor between substrate and metal cover
AssigneeTexas Instruments Incorporated
InventorsDaniel Baudouin, Alton Carpenter, James Wallace
Life of this patent
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Abstract
A memory card has a housing including an interior chamber and a top metal cover. A substrate is located in the interior chamber and carries printed circuit leads, packaged semiconductor devices connected to selected printed circuit leads, and a connector connected to selected printed circuit leads. The packaged semiconductor devices are spaced from the top metal cover and a thermal coupler is located between the top metal cover and the packaged semiconductor devices for coupling heat generated by the packaged semiconductor devices to the top metal cover.
Claims7
A memory card, comprising:
- a housing including an interior chamber and a top metal cover;
- a substrate in said chamber, said substrate carrying printed circuit leads, packaged semiconductor devices connected to selected printed circuit leads, and a connector connected to selected printed circuit leads, said packaged semiconductor devices being spaced from said top metal cover, said substrate including a plated through hole connected to circuit ground and a flexible conductor soldered in said plated through hole and extending through said housing to contact said top metal cover;
- and
- a thermal coupler between said top metal cover and said packaged semiconductor devices for coupling heat generated by said packaged semiconductor devices to said top metal cover.
Dependencies are inferred from the claim text.