US 5,208,729 AGranted

Multi-chip module

AssigneeInternational Business Machines Corporation

InventorsThomas M. Cipolla, Paul W. Coteus, Glen W. Johnson, Lawrence S. Mok

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Abstract

A high density package for a plurality of integrated circuit chips is described, the package including a number of planar subunits. A subunit includes first and second planar metal plates and a spacer metal plate sandwiched therebetween. Each spacer metal plate is provided with a plurality of circuit-receiving apertures. A planar circuit carrier is provided for each aperture in the spacer metal plate. One face of each circuit carrier includes a plurality of bonded chips. Each circuit carrier is positioned in a circuit-receiving aperture so that rear aspects of the bonded chips bear upon the second planar metal plate. Each circuit carrier has a connector region which extends out from between the first planar metal plate and the metal spacer plate at one extremity of each circuit-receiving aperture. A circuit card is positioned at that extremity and has a plurality of interconnection areas, one for each extended connector region. The circuit card has its major surface oriented parallel to the metal plates so that the entire package presents an overall planar configuration.

Claims26

Dependent claims

A high density package for a plurality of integrated circuit chips, the combination comprising:

first and second planar metal plates;
a spacer metal plate sandwiched between said first and second planar metal plates, said spacer metal plate having a plurality of spaced apart circuit-receiving apertures therein;
a plurality of planar circuit carriers, one face of each said circuit carriers including a plurality of bonded chip means, each said circuit carrier positioned in a circuit-receiving aperture in said spacer metal plate so as to maintain said bonded chip means in heat exchange contact with a said planar metal plate, regions of said first and second metal plates positioned intermediate said apertures serving as heat dissipation regions, each said planar circuit carrier having a connector region that extends out from between said first metal plate and said spacer metal plate at an extremity of a said circuit receiving aperture;
and
a circuit card positioned at said extremity and provided with a plurality of interconnection areas, one for each said extended connector region, said circuit card having a major surface positioned parallel to said plates;
and
means for rigidly connecting said first and second planar metal plates, said spacer metal plate and said circuit card to enable said package to manifest an overall planar and unitary configuration.

4 more elements

A high density package for a plurality of integrated circuit chips, the combination comprising:

first and second metal plates exhibiting major surfaces;
a planar circuit carrier, one face of said circuit carrier including a plurality of bonded chip means, said circuit carrier positioned between said metal plates so as to create a sandwich structure that enables a face of each said chip means to contact a said metal plate, and having a connector region that extends out from between said metal plates;
pluralities of aligned rows of coolant passages formed in said first and second metal plates so as to pass through a thickness dimension of said sandwich structure and enable coolant to pass therethrough and dissipate heat from said chip means, each said chip means on said planar circuit carrier equidistantly positioned between a pair of rows of said aligned coolant passages;
and
a circuit card juxtaposed to said connector region and provided with an interconnection area for said connector region, said circuit card having a major surface positioned parallel to said plates;
and
means for rigidly coupling said first and second metal plates and said circuit card to create a package that presents an overall planar configuration.

4 more elements

Dependencies are inferred from the claim text.