Method of and apparatus for non-contact temperature measurement
AssigneeVarian Associates, Inc.
InventorJames A. Fair
Life of this patent
Estimating the term…
Abstract
The temperature and radiant energy emissivity of a semiconductor substrate or wafer undergoing processing are monitored by combining indications derived from an interferometer and the intensity of radiant energy emitted from the substrate. The radiant energy intensity is detected at adjacent maxima or minima in the intensity of the interference pattern.
Claims25
A non-contact method of determining the temperature of a plate that is not opaque to optical energy, the method comprising detecting the intensity of radiant energy emitted from the plate and deriving a first indication of said detected intensity, irradiating the plate with said optical energy, said optical energy interacting with the plate to provide alternate constructive and destructive interference patterns as the plate temperature varies and deriving a second indication of the amplitude of said patterns, and combining said second indication of the amplitude of the detected constructive and destructive interference patterns as the plate temperature varies and said first indication of the detected intensity of the emitted radiant energy to provide an indication of the plate temperature.
In combination, a processing chamber for a semiconductor substrate, non-contact means for determining the temperature of a semiconductor substrate in the chamber, said non-contact temperature determining apparatus including:
- means for irradiating a front face of the substrate with optical energy, the wavelength of the optical energy and the substrate being such that constructive and destructive interference patterns are derived as the temperature of the substrate varies, means for detecting the intensity of the optical energy in the constructive and destructive interference patterns as the temperature of the substrate varies, optical pyrometer means for detecting the intensity of radiation emitted from the substrate, and means for combining responses indicative of the intensity detected by said optical pyrometer means and indicative of the intensity of the optical radiation detected by said means for detecting the intensity of the optical energy in the constructive and destructive interference patterns as the temperature of the substrate varies to provide a signal indicative of the substrate temperature.
Non-contact apparatus for determining the temperature of a plate comprising means for irradiating the plate with optical energy, the wavelength of the optical energy and the plate being such that alternate constructive and destructive interference patterns occur as the plate temperature varies, means for detecting the intensity of the optical energy in the alternate constructive and destructive interference patterns as the plate temperature varies, optical pyrometer means for detecting the intensity of radiation emitted from the substrate, and means for combining responses indicative of the intensity detected by said optical pyrometer means and indicative of the intensity of the optical radiation detected by said means for detecting the intensity of the optical energy of the alternate constructive and destructive interference patterns as the plate temperature varies to provide a signal indicative of the plate temperature.
A method of determining the temperature of a plate undergoing dynamic temperature changes causing the plate thickness to change, comprising irradiating the plate with optical energy, the plate being non-opaque to the optical energy so that constructive and destructive interference patterns of the optical energy are derived from the plate in response to the temperature and thickness changes, the constructive and destructive interference patterns resulting in a beam of the optical radiation having intensity variations that are periodic as a function of the plate temperature, the intensity variations as a function of plate thickness having a known period, monitoring the intensity of radiation emitted from the plate at times when the intensity of the optical radiation is at predetermined angular positions of the periodic function, and combining indications of the separation of the angular positions and the intensity of said monitored radiation to derive the temperature indication.
Apparatus for determining the temperature of a plate undergoing dynamic temperature changes causing the plate thickness to change, comprising means for irradiating the plate with optical energy, the plate being non-opaque to the optical energy so that constructive and destructive interference patterns of the optical energy are derived from the plate in response to the temperature and thickness changes, the constructive and destructive interference patterns resulting in a beam of the optical radiation having intensity variations that are periodic as a function of the plate temperature, the intensity variations as a function of plate thickness having a known period, means responsive to the radiation having said periodic intensity variations and the intensity of radiation emitted from the plate at times when the intensity of the optical radiation is at predetermined angular positions of the periodic function for combining indications of the separation of the angular positions and the intensity of said monitored radiation to derive the temperature indication.
A non-contact method of determining the temperature of a plate that is not opaque to optical energy, the method comprising detecting the intensity of radiant energy passively emitted from the plate and deriving a first indication of said detected intensity, irradiating the plate with said optical energy, said optical energy interacting with the plate to provide alternate constructive and destructive interference patterns as the plate temperature varies and deriving a second indication of the amplitude of said patterns, and combining said second indication of the amplitude of the detected constructive and destructive interference patterns as the plate temperature varies and said first indication of the detected intensity of the emitted radiant energy to provide an indication of the plate temperature.
In combination, a processing chamber for a semiconductor substrate, non-contact means for determining the temperature of a semiconductor substrate in the chamber, said non-contact temperature determining apparatus including:
- means for irradiating a front face of the substrate with optical energy, the wavelength of the optical energy and the substrate being such that constructive and destructive interference patterns are derived as the temperature of the substrate varies, means for detecting the intensity of the optical energy in the constructive and destructive interference patterns as the temperature of the substrate varies, optical pyrometer means for detecting the intensity of radiation passively emitted from the substrate, and means for combining responses indicative of the intensity detected by said optical pyrometer means and indicative of the intensity of the optical radiation detected by said means for detecting the intensity of the optical energy in the constructive and destructive interference patterns as the temperature of the substrate varies to provide a signal indicative of the substrate temperature.
Non-contact apparatus for determining the temperature of a plate comprising means for irradiating the plate with optical energy, the wavelength of the optical energy and the plate being such that alternate constructive and destructive interference patterns occur as the plate temperature varies, means for detecting the intensity of the optical energy in the alternate constructive and destructive interference patterns as the plate temperature varies, optical pyrometer means for detecting the intensity of radiation passively emitted from the substrate, and means for combining responses indicative of the intensity detected by said optical pyrometer means and indicative of the intensity of the optical radiation detected by said means for detecting the intensity of the optical energy of the alternate constructive and destructive interference patterns as the plate temperature varies to provide a signal indicative of the plate temperature.
Dependencies are inferred from the claim text.