Curing resin composition and its cured product
AssigneeShin-Etsu Chemical Co., Ltd.
InventorsMitsuhiro Takarada, Yuji Yoshikawa, Kenji Yamamoto, Hiroharu Ohsugi, Atsushi Ohgaki, Ryozo Takagawa
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Abstract
This invention discloses a curing resin composition comprising (a) an organic resin containing no less than 2 alkenyl groups per molecule, and having a number average molecular weight of 500-100,000. (b) an organohydrogen-polysiloxane containing no less than 2 Si--H bonds per molecule, and (c) a platinum catalyst. It is desired that the organic resin of component (a) is at least one type chosen from acrylic, polyester and epoxy. The preferable amount of component (b) is such that there are 0.8-4 hydrogen atoms bonded to silicon atoms per alkenyl group of component (a).
Claims19
A curing resin composition comprising (a) an acrylic resin containing no less than two alkenyl groups per molecule and having a number average molecular weight of 500-100,000, (b) an organohydrogenpolysiloxane containing no less than two Si-H bonds per molecule, and (c) a platinum catalyst, wherein the acrylic resin containing alkenyl groups of component (a) is a copolymerization product of an acrylic monomer containing alkenyl groups and another polymerizable monomer, an addition reaction product of an acrylic resin containing hydroxyl groups and an alkenyl isocyanate compound and/or carboxylic acid anhydride containing alkenyl groups, an addition reaction product of an acrylic resin containing carboxyl groups and an epoxy compound containing alkenyl groups, or an addition reaction product of an acrylic resin containing epoxy groups and carboxylic acids containing alkenyl groups.
Dependencies are inferred from the claim text.