Method of producing treated copper foil, products thereof and electrolyte useful in such method
AssigneeCircuit Foil USA, Inc.
InventorsAdam M. Wolski, Laurette M. Maguet, Michel Streel
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Abstract
An improved treatment for copper foil comprising electrodepositing a metallic barrier layer of copper, zinc and antimony on at least one side of the foil which, preferably, has a matte surface formed prior to forming the barrier layer. The so-treated foil provides a high bonding strength when laminated to polymeric substrates and resists undercutting by mineral acid etchants and rinses during production of printed circuit boards.
Claims12
A method of treating copper foil comprising forming on at least one side thereof an electrodeposited metallic barrier layer comprising about 65-80 weight % copper, about 20-35 weight % zinc and about 2-5 weight % antimony.
An electrolyte comprising an aqueous solution of the following ingredients in the indicated amounts:
- ______________________________________ copper sulfate 25-100 grams per liter zinc sulfate 6-24 grams per liter potassium pyrophosphate 100-350 grams per liter potassium, sodium tartrate 10-50 grams per liter antimony potassium tartrate 0.5-5 grams per liter ______________________________________
- and having a pH of about 8-9.
Dependencies are inferred from the claim text.