Electroplating process and composition
AssigneeShipley Company, L.L.C.
InventorJohn J. Bladon
Life of this patent
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Abstract
A process for electroplating a nonconducting substrate comprising formation of a catalytic metal sulfide on the surface of a nonconducting substrate and electrolytic deposition of metal thereover. The catalytic metal chalcogenide is preferably palladium sulfide.
Claims15
A method for electroplating a nonconductor comprising the steps of contacting the surface of the nonconductor to be plated with a preformed colloid of a catalytic metal chalcogenide and metal plating the surface of the nonconductor by passing a current between electrodes immersed in an electrolyte containing dissolved plating metal where one of said electrodes comprises said nonconductor to be plated.
A method for making a printed circuit board, said method comprising the steps of providing a copper clad printed circuit board base material having an array of holes drilled therethrough, contacting said circuit board base material with a preformed colloid of a catalytic metal chalcogenide and metal plating the surface of the printed circuit board base material by passing a current between electrodes immersed in an electrolyte containing dissolved plating metal where one of said electrodes comprises said printed circuit board base material to be plated.
Dependencies are inferred from the claim text.