Semi-additive circuitry with raised features using formed mandrels
AssigneeHughes Aircraft Company
InventorsWilliam R. Crumly, Christopher M. Schreiber, David B. Swarbrick
Life of this patent
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AssigneeHughes Aircraft Company
InventorsWilliam R. Crumly, Christopher M. Schreiber, David B. Swarbrick
Estimating the term…
A circuit is produced by using a formed mandrel (10,12) and semi-additive techniques for creating circuit traces. A stainless steel mandrel (10) flash plated with copper (14) includes a depression (12) which will form a raised interconnection feature (24). Using a photolithographically formed pattern of photoresistive material (16) on the mandrel the selected pattern of circuit traces (18,20) and raised features (24) are electroplated onto the flash plated mandrel. After stripping the photoresist (16), a dielectric substrate (26) is laminated to the circuit traces, effectively encapsulating the traces on three sides. After removing the laminated circuit traces and dielectric from the mandrel the flash plated copper (14) is removed and the circuit covered with an insulation coverlay.
A method of making a multi-layer circuit having raised features comprising the steps of:
A mandrel for reproducibly forming a raised feature multi-layer circuit by electrodeposition comprising:
A method for making a multi-layer electric circuit having raised features comprising the steps of:
Dependencies are inferred from the claim text.