Multilayer structure and method for fabricating the same

A method of fabricating a multilayer structure, comprising the steps of:

• forming a first electrically conductive pattern on an insulative substrate having a first electrically conductive via lead extending therethrough for electrically connecting components on opposite sides of said substrate;
• forming a resist layer over said substrate and said first pattern, said resist layer having a via hole therethrough communicating with said first pattern;
• forming a second electrically conductive via lead in said via hole by electrically plating a metal therein utilizing said first via lead as an electroplating lead during said plating operation, said second via lead being formed in electrical contact with said first pattern;
• removing said resist layer;
• coating an insulative resin layer over said substrate, said first pattern and said second via lead;
• etching the surface of said resin layer at a location adjacent said second via lead to selectively remove the resin layer until a top segment of said second via lead protrudes to a predetermined height above the etched surface of said resin layer;
• and
• forming a second electrically conductive pattern over said resin layer and over the protruding top segment of said second via lead.

A method of fabricating a multilayer structure, comprising the steps of:

• forming a first electrically conductive pattern on an insulative substrate;
• forming a first electrically conductive layer on said first pattern;
• forming a resist layer over said first layer, said resist layer having a via hole therethrough communicating with said first layer;
• forming a conductive via lead in said via hole by electrically plating a metal therein utilizing said first layer as an electroplating lead during said plating operation, said conductive via lead thereby being formed in electrical contact with said first layer;
• removing said resist layer;
• removing a predetermined portion of said first layer;
• coating an insulative resin layer over said substrate, a residual portion of said first layer and said via lead;
• etching the surface of said resin layer at a location adjacent said via lead to selectively remove the resin layer until a top segment of said via lead protrudes to a predetermined height above the etched surface of said resin layer;
• and
• forming a second electrically conductive pattern over said resin layer and over the protruding top segment of said first via lead.

A method of fabricating a multilayer structure, comprising the steps of:

• forming a first electrically conductive pattern on an insulative substrate;
• forming a resist layer over said substrate and over said first pattern, said resist layer having a via hole therethrough communicating with said first pattern;
• forming a conductive via lead in said via hole by electrically plating a metal therein, said conductive via lead being formed in electrical contact with said first pattern;
• removing said resist layer;
• forming an insulative resin layer over said substrate, said first pattern and said via lead;
• etching the surface of said resin layer at a location adjacent said via lead to selectively remove the resin layer until a top segment of said via lead protrudes to a predetermined height above the etched surface of said resin layer;
• and
• forming a second electrically conductive pattern over said resin layer and over the protruding segment of said via lead.