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AssigneeInternational Business Machines Corporation
InventorsJoseph Funari, Ronald J. Moore
Estimating the term…
A method for bonding a semiconductor device onto a substrate (e.g., a printed circuit board) such that solder elements on the device are connected, respectively, to circuit elements on the substrate. The solder elements are heated by passing hot gas onto an opposing surface of the device such that, by heat transference, the solder elements become partially molten to form the desired connections. Pressure is also applied onto the device during this formation to assure planarity at the connection sites. Following formation, cooling of the connections is accomplished. By directing heated gas onto only the semiconductor device and not onto the solder element-circuit member locations (and thus onto the substrate), direct semiconductor device bonding to lower melting point temperature substrates (e.g., those circuit boards containing fiberglass reinforced epoxy resin as a dielectric) may be achieved.
A method of soldering a semiconductor device having a plurality of solder elements located along a first surface thereof to a substrate having a plurality of circuit members thereon, said method comprising:
Dependencies are inferred from the claim text.