Integrated circuit package with device and wire coat assembly
AssigneeVLSI Technology, Inc.
InventorJon M. Long
Life of this patent
Estimating the term…
Abstract
A molded, plastic integrated circuit package is formed wherein a silicone compound is first applied over the exposed surface of the integrated circuit, its bonding wires, and portions of the lead frame including those portions where the bonding wires are attached. Following application of the silicone compound and before molding in plastic, the silicone compound is cured to set and harden the material. With the bonding wires and bonding points thus encapsulated by the silicone compound, the bonding wires are protected from lateral bending forces caused by viscous forces during the process of forming the molded plastic package, and from longitudinal expansion and contraction forces during thermal temperature cycling of the package.
Claims18
An integrated circuit package comprising:
- an integrated circuit die,
- a lead frame,
- at least one bonding wire having one end attached to said integrated circuit die and an opposite end attached to said lead frame,
- a heat conductive tape having a surface with a heat conductive strip, said surface having first and second locations, said heat conductive strip being thermally connected to said first and second locations,
- means for attaching said heat conductive tape to said integrated circuit die at said first location and to said lead frame at said second location,
- a layer of a first encapsulating material contacting and covering said integrated circuit die and said at least one bonding wire including its attachment points to said integrated circuit die and said lead frame, and
- a layer of a second encapsulating material contacting and covering said layer of first encapsulating material,
- wherein said heat conductive tape acts as a support base for said layer of first encapsulating material.
A method of packaging an integrated circuit die, a portion of a lead frame, and at least one bonding wire which is attached to said die at one end and said lead frame at an opposite end, comprising the steps of:
- forming a heat conductive tape having a heat conductive strip,
- attaching said heat conductive tape to said integrated circuit die and to said lead frame in such a fashion that said heat conductive strip thermally connects said integrated circuit die to said lead frame,
- forming a first encapsulation layer on said heat conductive tape such that said layer contacts and covers said at least one bonding wire, and
- forming a second encapsulation layer which contacts and covers said first encapsulation layer.
An integrated circuit package comprising:
- an integrated circuit die,
- a lead frame,
- at least one bonding wire having one end attached to said integrated circuit die and an opposite end attached to said lead frame,
- a heat conductive backing having a top and bottom surface, said integrated circuit die being attached to said top surface,
- an adhesive tape having a surface with a heat conductive strip, said surface having first and second locations, said heat conductive strip being thermally connected to said first and second locations, said adhesive tape being attached to said lead frame at said first location and being attached to said heat conductive backing at said second location,
- a layer of a first encapsulating material contacting and covering said integrated circuit die and said at least one bonding wire including its attachment points to said integrated circuit die and said lead frame, and
- a layer of a second encapsulating material contacting and covering said layer of first encapsulating material,
- wherein said adhesive tape acts as a support base for said layer of first encapsulating material.
Dependencies are inferred from the claim text.