Attachment for contacting a heat sink with an integrated circuit chip and use thereof
AssigneeInternational Business Machines Corporation
InventorScott D. Reynolds
Life of this patent
Estimating the term…
Abstract
An attachment for removably thermally contacting a heat sink with an integrated circuit chip located on a chip carrier which in turn is located on an integrated circuit card or board containing a body portion for contacting the chip, flange members extending from the body portion. Each of the flange members contains a pad-like member located at the end for contacting with the card or board. A compliant portion is present that extends away from the body portion for contacting the heat sink.
Claims31
An attachment for removably and thermally contacting a heat sink with an integrated circuit chip located on a chip carrier which is located on an integrated circuit card or board, said attachment comprises:
- a body portion for contacting the integrated circuit chip;
- a plurality of flange members extending from said body portion;
- each of said flange members containing a pad-like member located at its end farthest from said body portion, wherein said pad-like members being for contacting the integrated circuit card or board;
- a compliant portion extending away from said body portion in a direction different from said flange members for contacting the heat sink;
- and wherein said portion, said flange members, said pad-like members and said compliant portion are thermally conducting.
An integrated circuit package comprising:
- an integrated circuit chip located on a chip carrier which is located on an integrated circuit card or board;
- a heat sink;
- and
- an attachment interposed between said heat sink and said integrated circuit chip for removeably and thermally contacting said heat sink with said integrated circuit chip, said attachment including a body portion for contacting said integrated circuit chip, a plurality of flange members extending from said body portion, each of said flange members containing a pad-like member located at its end farthest from said body portion, wherein said pad-like members being for contacting said integrated circuit card or board, a compliant portion extending away from said body portion in a direction for contacting said heat sink, and wherein said body portion, said flange members, said pad-like members and said compliant portion are thermally conducting.
A method for fabricating an integrated circuit chip package which comprises:
- providing an attachment for interposing between heat sink and an integrated circuit chip and for removeably and thermally contacting said heat sink with said integrated circuit chip, said attachment including a body portion for contacting said integrated circuit chip, a plurality of flange members extending from said body portion, each of said flange members containing a pad-like member located at its end farthest from said body portion, wherein said pad like members being for contacting an integrated circuit card or board, a compliant portion extending away from said body portion in a direction for contacting said heat sink, and wherein said body portion, said flange members, said pad-like members and said compliant portion are thermally conducting;
- providing said integrated circuit chip on a chip carrier;
- providing said carrier on said integrated circuit card or board;
- providing adhesive on that surface of the body portion of said attachment that is to contact said integrated circuit chip;
- providing means for attaching said pad-like members to said circuit card or board;
- bringing said attachment into contact with said integrated circuit chip and contacting said pad-like members with said integrated circuit chip;
- then subjecting said card or board to elevated temperature in order to cause bonding of said attachment to said chip;
- and
- then attaching a heat sink such that said heat sink is in thermal contact with the compliant portion of said attachment.
Dependencies are inferred from the claim text.