Building block approach to microwave modules

An electronic system comprising:

• first and second microwave modules, each of said microwave modules including:
• a module substrate,
• a microwave electronic component disposed on said module substrate,
• a module dielectric layer overlying said substrate and said microwave component,
• a module ground conductor ohmically connected to a ground conductor of said microwave component,
• a module signal conductor disposed on said module dielectric layer and ohmically connected to a microwave signal terminal of said microwave component, said module signal conductor being spaced from said module ground conductor to form a module microwave transmission line;
• said dielectric layer of first module being distinct from said dielectric layer of said second module;
• a system dielectric layer overlying said first and second modules;
• a system ground conductor;
• first and second system signal conductors each disposed on said system dielectric layer and coupled respectively to said signal conductors of said first and second modules;
• and
• said system ground conductor in combination with said first and second system signal conductors forming, respectively, first and second system microwave transmission lines which are respectively coupled to said module microwave transmission lines of said first and second modules.

An electronic system comprising:

• first and second microwave modules, each of said microwave modules including:
• a microwave electronic component,
• a module dielectric layer overlying said microwave component,
• a module ground conductor ohmically connected to a ground conductor of said microwave component,
• a module signal conductor disposed on said module dielectric layer and ohmically connected to a microwave signal terminal of said microwave component, said module signal conductor being spaced from said module ground conductor to form a module microwave transmission line;
• said dielectric layer of first module being distinct from said dielectric layer of said second module;
• a system dielectric layer overlying said first and second modules;
• a system ground conductor;
• first and second system signal conductors each disposed on said system dielectric layer and coupled respectively to said signal conductors of said first and second modules;
• and
• said system ground conductor in combination with said first and second system signal conductors forming, respectively, first and second system microwave transmission lines which are respectively coupled to said module microwave transmission lines of said first and second modules.

An electronic system comprising:

• a system substrate;
• first and second microwave modules mounted on said substrate, each of said microwave modules including:
• a module substrate,
• a microwave electronic component disposed on said module substrate,
• a module dielectric layer overlying said substrate and said microwave component,
• a module ground conductor ohmically connected to a ground conductor of said microwave component,
• a module signal conductor disposed on said module dielectric layer and ohmically connected to a microwave signal terminal of said microwave component, said module signal conductor being spaced from said module ground conductor to form a module microwave transmission line;
• said dielectric layer of first module being distinct from said dielectric layer of said second module;
• a system dielectric layer overlying said first and second modules;
• a system ground conductor;
• first and second system signal conductors each disposed on said system dielectric layer and coupled respectively to said signal conductors of said first and second modules;
• and
• said system ground conductor in combination with said first and second system signal conductors forming, respectively, first and second system microwave transmission lines which are respectively coupled to said module microwave transmission lines of said first and second modules.

A packaged microwave component comprising:

• a package substrate,
• a microwave component disposed on said package substrate,
• a first package dielectric layer overlying said substrate and said microwave component,
• a first package conductor disposed on said first package dielectric layer,
• a second package dielectric layer overlying said first package conductor, and
• a second package conductor overlying said second package dielectric layer;
• said second package conductor being spaced from said first package conductor by said second package dielectric layer to form a package microwave transmission line, one of said first and second package conductors being the signal conductor of said package microwave transmission line and ohmically connected to a microwave signal terminal of said microwave component and the other of said first and second package conductors being a ground conductor of said package microwave transmission line and ohmically connected to a ground conductor of said microwave component;
• said package microwave transmission line having a port portion suitable for coupling to an external microwave transmission line, said port portion exhibiting a specified microwave transmission line impedance, whereby said component is suitable for assembly into a larger system.

An electronic system comprising:

• a system substrate;
• first and second microwave modules mounted on said substrate, each of said microwave modules including:
• a module substrate,
• a microwave component disposed on said module substrate,
• a first module dielectric layer overlying said substrate and said microwave component,
• a first module conductor disposed on said first module dielectric layer,
• a second module dielectric layer overlying said first module conductor,
• a second module conductor overlying said second module dielectric layer,
• said second module conductor being spaced from said first module conductor by said second module dielectric layer to form a module microwave transmission line, one of said first and second module conductors being the signal conductor of said module microwave transmission line and ohmically connected to a microwave signal terminal of said microwave component and the other of said first and second module conductors being a ground conductor of said module microwave transmission line and ohmically connected to a ground conductor of said microwave component;
• said dielectric layers of first module being separate from said dielectric layers of said second module;
• a first system dielectric layer overlying said first and second modules;
• first, second, third and fourth system conductors, said first and third system conductors being disposed on said first system dielectric layer;
• a second system dielectric layer overlying said first and third system conductors, said second and fourth system conductors being disposed on said second system dielectric layer;
• said first and second system dielectric layers each comprising a polymer;
• said first and second system signal conductors forming a first system microwave transmission line and being coupled to said module microwave transmission line of said first module;
• said third and fourth system signal conductors forming a second system microwave transmission line and being coupled to said module microwave transmission line of said second module.