Comb insert for semiconductor packaged devices

A semiconductor packaged device, comprising:

• a semiconductor chip having a major surface with bonding pads thereon disposed within an encapsulating material;
• a lead frame having a first side of adjacent lead fingers and a second side of adjacent lead fingers, the first side of adjacent lead fingers and the second side of adjacent lead fingers having outer ends extending through the encapsulating material and having downset inner tips overlying the major surface of the semiconductor chip for connecting to the bonding pads of the semiconductor chip;
• and
• a conductive comb disposed above the major surface of the semiconductor chip having comb teeth lying between the downset inner tips of the lead fingers of the first side of adjacent lead fingers, having two comb teeth electrically connected to the downset inner tips of two different lead fingers of the first side of adjacent lead fingers.

A lead frame comprising:

• a plurality of lead fingers formed of metal sheet stock having tips for connecting to an integrated circuit;
• a power supply bus formed of a contiguous piece of metal sheet stock, having:
• a first metal portion under the lead fingers and transversely disposed to the tips of the plurality of lead fingers;
• and
• a plurality of second metal portions, coplanar with the tips of the plurality of lead fingers, extending from the first metal portion so that they are between and substantially parallel to the plurality of lead finger tips.