Oscillator package
OwnerMu K. Yanginventor
Life of this patent
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Abstract
An oscillator package includes a header substrate with a number of through holes formed therein, a copper post passed through each through hole, a ceramic substrate securely mounted to and supported by the copper posts for mounting a die and a crystal thereon, a substantially L-shaped lead securely attached to an underside as well as a lateral side of the header substrate and contacting each copper post, and a ceramic cover housing the die and crystal. A metal film is applied to an inner periphery of the hole, and the copper posts are mounted in the holes after the metal-film is sintered. An outer periphery of the copper post is plated by nickel then gold. The lead is mountable to a circuit board by soldering, and the solder covers an overall area of the lead. The ceramic cover has at least a 90% weight of aluminum oxide.
Claims6
An oscillator package capable of being mounted on a circuit board by surface mounting technique, comprising:
- a header substrate with a plurality of through holes formed therein;
- a copper post passed through each said through hole, each said copper post having a first flange formed at an underside of said header substrate and a second flange formed at an upper side of said header substrate;
- a ceramic substrate securely mounted to and supported by said second flanges of said copper posts for mounting a die thereon;
- a substantially L-shaped lead securely attached to an underside as well as a lateral side of said header substrate, contacting each copper post, such that said first flange is at an underside of said L-shaped lead;
- and
- a ceramic cover provided on an upper side of said header substrate for housing and sealing said die and said crystal.
Dependencies are inferred from the claim text.