Low dielectric constant, low moisture uptake polyimides and copolyimides for interlevel dielectrics and substrate coatings
AssigneeAmoco Corporation
InventorsAllyson J. Beuhler, Neal R. Nowicki, Douglas E. Fjare
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Abstract
A group of polyimides and copolyimides made from 6FDA, IPAN, or their acid or ester forms, and selected aromatic diamines are disclosed which are useful for substrate coatings and interlevel dielectrics in on-chip and multi-chip package applications. In such applications these polymers exhibit lower dielectric constant, lower moisture uptake and reduced dielectric constant variation with temperature and humidity than existing polymers, yet they are both thermally stable at required processing temperatures and can form suitably adherent, pinhole-free coatings on electronic component substrates.
Claims15
An interlevel dielectric comprising a thin layer of a polyimide or copolyimide made essentially from a compound selected form the group consisting of 2,2-bis(3,4-dicarboxyphenyl)propane dianhydride, 2,2-bis(3,4-dicarboxyphenyl)hexafluoropropane dianhydride, and their respective acids and esters, and an aromatic diamine selected from the group consisting of 2,2-bis(4-aminophenyl)propane and 4,4'-bis(p-aminophenoxy)biphenyl coated on a substrate to form a coated substrate overlayed with a thin adhering layer of a metal or an inorganic material.
An interlevel dielectric comprising a thin layer of a polyimide or copolyimide made essentially from a compound selected from the group consisting of 2,2-bis(3,4-dicarboxyphenyl)propane dianhydride, 2,2-bis (3,4-dicarboxyphenyl) hexafluoropropane dianhydride, and their respective acids and esters, and 2,2-bis{4-(p-aminophenoxy)phenyl} propane coated on a substrate to form a coated substrate, said coated substrate overlayed with a thin adhering layer of a metal or an inorganic material.
Dependencies are inferred from the claim text.