US 5,206,074 A · Adhesives on polymide films and methods of preparing them

Abstract

Disclosed is a polymeric product of diglycidyl bis phenol p-dialkyl benzene, and dicyanate diphenyl hexafluoro isopropane. Also disclosed is an organic polymeric dielectric composite of organic polymeric films, as polyimide films, dispersed in and reinforcing the organic polymeric adhesive reaction product of diglycidyl bis phenol p-dialkyl benzene, and dicyanate diphenyl hexafluoro isopropane. Further disclosed is an electronic circuit package that is adapted to receive at least one microelectronic circuit chip, with at least one layer having a substrate of an organic polymeric dielectric composite of organic polymeric films and the organic polymeric adhesive reaction product of diglycidyl bis phenol p-dialkyl benzene, and dicyanate diphenyl hexafluoro isopropane.

Claims4

Dependent claims

An electronic circuit package adapted to receive at least one microelectronic circuit chip having signal leads, a power lead, and a ground lead;

said circuit package comprising a laminate of individual cores, at least one core comprising a substrate of an organic polymeric dielectric composite comprising:
(a). an organic polymeric film;
and
(b). an organic copolymeric adhesive reaction product of
(i) diglycidyl bis phenol p-dialkyl benzene, and
(ii) dicyanate diphenyl hexafluoro isopropane, said organic film carrying and reinforcing said copolymeric adhesive, said internal core having Cu circuitization adapted to co-operate with at least one of said leads on at least one surface thereof.

3 more elements

Dependencies are inferred from the claim text.

Facts

Application

07/657,795Filed 20 Feb 1991 · continuation in part

Priority

3 Apr 1987

Granted

27 Apr 1993

Term ends

Not estimatedThe source records don’t support an estimate.

Classification17 codes

C08G 59/4014
Curing agents not provided for by the groups C08G59/42 - C08G59/66: nitrogen containing compounds
B32B 7/12
Interconnection of layers: using interposed adhesives or interposed materials with bonding properties
B32B 15/08
Comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material: of synthetic resin
B32B 15/20
Layered products comprising a layer of metal: comprising aluminium or copper

Family

Serial33,557Parent of this division · filed 3 Apr 1987

Serial154,861Parent of this continuation-in-part · filed 10 Feb 1988

Serial380,195Parent of this continuation-in-part · filed 17 Jul 1989

US 5,015,719 AParent of this continuation-in-part

US 4,745,215 AParent of this division

US 5,206,074 AThis patent

From the US filing history. Foreign family members aren’t listed.

Adhesives on polymide films and methods of preparing them

Life of this patent

Adhesives on polymide films and methods of preparing them

Life of this patent

Abstract

Claims4