Electroless plating process
AssigneeHitachi Chemical Company, Ltd.
InventorsAkishi Nakaso, Kaoru Oginuma, Takeshi Shimazaki, Akio Takahashi
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Abstract
An aqueous solution comprising sulfuric acid, cupric chloride and, if necessary, an organic acid is effective as an activation accelerating treatment for electroless palting for improving electroless plating in through-holes and for improving adhesive strength between a copper foil and an electrolessly plated copper.
Claims12
A process for carrying out electroless plating which consists of:
- conditioning a surface of a material to be plated,
- contacting the resulting material with an aqueous catalyst solution for electroless plating,
- subjecting the resulting material contacted with the aqueous catalyst solution for electroless plating to an activation accelerating treatment, and
- carrying out electroless plating;
- the material to be plated comprising an insulating substrate and a metal layer or foil adhered thereto, and said activation accelerating treatment being carried out by using an aqueous solution consisting of water, sulfuric acid and cupric chloride;
- the concentration of sulfuric acid being 0.01 to 5 mole/liter and the concentration of cupric chloride being 0.00003 to 0.03 mole/liter.
A process for carrying out electroless plating which consisting:
- conditioning a surface of a material to be plated,
- contacting the resulting material with an aqueous catalyst solution for electroless plating,
- subjecting the resulting material contacted with the aqueous catalyst solution for electroless plating to an activation accelerating treatment, and
- carrying out electroless plating;
- the material to be plated comprising an insulating substrate and a metal layer or foil adhered thereto, and said activation accelerating treatment being carried out by using an aqueous solution consisting of water, sulfuric acid, cupric chloride and an organic acid;
- the concentration of sulfuric acid being 0.01 to 5 mole/liter, the concentration of cupric chloride being 0.00003 to 0.03 mole/liter and the concentration of the organic acid being 5 mole/liter or less.
A process for carrying out electroless plating which consists of:
- conditioning a surface of a material to be plated comprising an insulating material and a metal layer or foil adhered thereto,
- dipping the material to be plated in an aqueous solution containing a catalyst for electroless plating,
- dipping the material to be plated in an aqueous solution consisting of water, sulfuric acid and cupric chloride wherein the concentration of sulfuric and is 0.01 to 5 mole/liter and the concentration of cupric chloride is 0.00003 to 0.03 mole/liter, and
- conducting an electroless plating to form metal layers on inner walls of through-holes in the material to be plated for electrical connection.
A process for carrying out electroless plating which consists of:
- conditioning a surface of a material to be plated comprising an insulating material and a metal layer or foil adhered thereto,
- dipping the material to be plated in an aqueous solution containing a catalyst for electroless plating,
- dipping the material to be plated in an aqueous solution consisting of water, sulfuric acid, cupric chloride and an organic acid wherein the concentration of sulfuric acid is 0.01 to 5 mole/liter, the concentration of cupric chloride is 0.0003 to 0.03 mole/liter and the concentration of organic acid is 5 mole/liter or less, and
- conducting an electroless plating to form metal layers on inner walls of through-holes in the material to be plated for electrical connection.
Dependencies are inferred from the claim text.