Cathode sputtering apparatus
AssigneeLeybold Aktiengesellschaft
InventorJaroslav Zejda
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Abstract
A cathode sputtering apparatus for the coating of substrates in a vacuum chamber is presented which accommodates a rotating substrate carrier, and which comprises at least one gripper which includes a hub and at least one arm with a gripper with the hub rotating around a horizontal axis; during the sputtering, two annular closing elements separate a segment in front of the station from the remaining portion of the vacuum chamber and a cathode vacuum chamber is thus formed which is separate from the vacuum chamber of the apparatus.
Claims15
Cathode sputtering apparatus for coating substrates in a vacuum chamber which accommodates a rotating substrate carrier including a central hub, comprising at least one cathode sputtering station and at least one feeding and discharge station, wherein the substrate carrier further comprises at least one substrate gripper which interacts with a pair of annular closing elements of a lock valve which serves to separate the sputtering space in front of at least one cathode sputtering station from the remaining segment of the vacuum chamber.
Dependencies are inferred from the claim text.