High density parallel interconnect

A modified high density backplane connector comprising:

• a contact module comprising:
• means for aligning said modified high density backplane connector with first and second printed circuit boards;
• a first array of contacts disposed along a first plane of said contact module to electrically couple predetermined ones of signal and ground contact pads disposed on the first printed circuit board;
• and
• a second array of contacts disposed along a second plane of said contact module means said second plane being parallel to said first plane with said second array of contacts electrically coupled to predetermined ones of ground and signal contact pads disposed on the second printed circuit board;
• a matched impedance film disposed in contact with said first and second contact arrays said matched impedance film comprising:
• first and second arrays of contact pads corresponding to said first and second arrays of contacts, respectively, of said contact module means;
• and
• means for electrically interconnecting said first and second arrays of contact pads;
• at least one interactive biasing module means interacting with said matched impedance film for providing uniform contact force distribution and displacement tolerance relief for said first and second arrays of contacts of said contact module means, said interactive biasing means comprising:
• resilient pad means engaging said matched impedance film proximate to said first and second arrays of contact pads, respectively, of said conductive matrix for providing displacement tolerance relief for said first and second arrays of contacts of said contact module means;
• plate means engaging said resilient pad means for providing substantially uniform distribution of contact forces against said first and second arrays of contacts of said contact module means;
• and
• force generating spring means engaging said plate means for providing contact forces and for facilitating electrical coupling between said first and second arrays of contact pads of said matched impedance film and said first and second arrays of contact pads of said contact module means.

A modified high density backplane connector for mating and electrically interconnecting first and second printed circuit boards having predetermined geometric arrays of signal, ground and contact pads, comprising:

• contact module means for aligning said modified high density backplane connector with the second printed circuit board, said contact module means including a first array of contacts disposed in a first plane and a second array of contacts disposed in a second plane parallel to said first plane with said first and second array of contacts corresponding to the predetermined geometric arrays of signal and ground contact pads of the first and second printed circuit boards, respectively, and said second array of contacts being electrically interconnected to the predetermined geometric array of ground and signal contact pads of the second printed circuit board;
• flexible film means for providing a conductive matrix including first and second arrays of contact pads corresponding to said first and second arrays of contacts, respectively, of said contact module means and means for electrically interconnecting said first and second arrays of contact pads of said conductive matrix, said flexible film means interacting with said contact module means to provide electrical interconnection between said first and second arrays of contacts of said contact module means by means of said conductive matrix;
• at least one interactive biasing module means interacting with said flexible film means for providing substantially uniform contact force distribution and displacement tolerance relief for said first and second arrays of contacts of said contact module means, said interactive biasing means comprising:
• resilient pad means abutting said flexible film opposite said first and second arrays of contact pads, respectively, of said conductive matrix for providing displacement tolerance relief for said first and second arrays of contacts of said contact module means;
• plate means abutting said resilient pad means for providing substantially uniform distribution of contact forces over said first and second arrays of contacts of said contact module means;
• and
• force generating spring means engaging said plate means for providing said contact forces to bias said first and second arrays of contact pads of said conductive matrix into electrical engagement with said first and second arrays of contact pads of said contact module means.